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BOE MLED COB
Compared with traditional products equipped with front-loaded chips, BOE COB products with RGB full flip chip technology continue to improve the transmittance rate of the black film encapsulation program. It has more outstanding performance due to high protection and high reliability.
BOE MLED COB
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BOE MLED COB
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BOE MLED COB
Product Highlights
Cases
Product Parameters
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Product Highlights
RGB full flip
Reduce cost and improve quality
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Thin Package
Thinner<250um
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Black film package
Continue to improve picture quality
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Common cathode drive
Better experience closer to the screen
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High protection and high reliability
Reduce transport and maintenance risks
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Power/Dual-Link solution
Major projects are guaranteed
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Overseas qualification
Products are available for sale overseas
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Curved splicing
Enable multiple scenarios
Cases
Product Parameters
| BYH-COB | ||||||||||
|---|---|---|---|---|---|---|---|---|---|---|
| Specifications | BYH009 Ultra | BYH009V1 | BYH012V1 | BYH015V1 | ||||||
| Pitch | 0.9375 | 0.9375 | 1.25 | 1.5 | ||||||
| Module Size（mm） | 150*337.5 | 150*168.75 | ||||||||
| Cabinet Dimension（mm） | 600*337.5 | 600*337.5 | ||||||||
| Maintenance Mode | Front | |||||||||
| Cabinet flatness（mm） | ≤0.1 | |||||||||
| White balance brightness（cd/m2） | Typ 1500 | Typ 600, 0 - 800 Adjustable | ||||||||
| Refresh Rate（Hz） | 7680 | 3840 | ||||||||
| Installation mode | Stacking & Wall mounting | |||||||||
* Please click on the bottom of the project for more product details.
